{"id":8798,"date":"2026-04-02T11:41:33","date_gmt":"2026-04-02T03:41:33","guid":{"rendered":"https:\/\/www.sic-wafers.com\/?p=8798"},"modified":"2026-04-02T11:41:44","modified_gmt":"2026-04-02T03:41:44","slug":"how-many-skylake-chips-can-be-produced-on-a-300mm-wafer","status":"publish","type":"post","link":"https:\/\/www.sic-wafers.com\/cs\/how-many-skylake-chips-can-be-produced-on-a-300mm-wafer\/","title":{"rendered":"Kolik \u010dip\u016f Skylake lze vyrobit na 300mm waferu?"},"content":{"rendered":"
<\/div>\n

V\u00fdroba modern\u00edch mikroprocesor\u016f, jako je \u0159ada Skylake spole\u010dnosti Intel, za\u010d\u00edn\u00e1 na velk\u00fdch k\u0159em\u00edkov\u00fdch desti\u010dk\u00e1ch. Pro v\u00fdrobce polovodi\u010d\u016f, konstrukt\u00e9ry hardwaru a pr\u016fmyslov\u00e9 analytiky je z\u00e1sadn\u00ed pochopit, kolik \u010dip\u016f lze vyrobit z jednoho pl\u00e1tku. V tomto \u010dl\u00e1nku se budeme zab\u00fdvat faktory, kter\u00e9 ur\u010duj\u00ed po\u010det \u010dip\u016f Skylake vyroben\u00fdch ze standardn\u00ed 300mm (12palcov\u00e9) desky. k\u0159em\u00edkov\u00fd pl\u00e1tek<\/a>, s vyu\u017eit\u00edm osv\u011bd\u010den\u00fdch postup\u016f v oboru.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

1. \u00davod do architektury Skylake<\/h2>\n\n\n\n

Skylake je \u0161est\u00e1 generace mikroarchitektury Core spole\u010dnosti Intel, kter\u00e1 byla p\u0159edstavena v roce 2015. Je vyr\u00e1b\u011bna 14nm technologi\u00ed FinFET, podporuje v\u00edce jader, Hyper-Threading a integrovanou grafiku. V z\u00e1vislosti na modelu m\u016f\u017ee b\u00fdt procesor Skylake od dvouj\u00e1drov\u00e9ho mobiln\u00edho \u010dipu a\u017e po \u010dty\u0159j\u00e1drov\u00fd nebo \u0161estij\u00e1drov\u00fd desktopov\u00fd procesor, p\u0159i\u010dem\u017e velikost matrice se obvykle pohybuje mezi 122 mm\u00b2 a 151 mm\u00b2.<\/p>\n\n\n\n

Velikost matrice \u010dipu je rozhoduj\u00edc\u00ed, proto\u017ee p\u0159\u00edmo ovliv\u0148uje po\u010det \u010dip\u016f, kter\u00e9 lze vyrobit z jedn\u00e9 desti\u010dky.<\/p>\n\n\n\n

2. Pochopen\u00ed v\u00fdt\u011b\u017enosti desti\u010dek<\/h2>\n\n\n\n

A 300mm k\u0159em\u00edkov\u00fd pl\u00e1tek<\/strong> je v modern\u00ed v\u00fdrob\u011b polovodi\u010d\u016f standardem, kter\u00fd nab\u00edz\u00ed vysokou propustnost a ni\u017e\u0161\u00ed n\u00e1klady na \u010dip. Celkov\u00fd po\u010det \u010dip\u016f na desti\u010dku v\u0161ak z\u00e1vis\u00ed na n\u011bkolika faktorech:<\/p>\n\n\n\n

    \n
  1. Velikost matrice<\/strong> - V\u011bt\u0161\u00ed matrice zab\u00edraj\u00ed v\u011bt\u0161\u00ed plochu waferu, \u010d\u00edm\u017e se sni\u017euje celkov\u00fd po\u010det \u010dip\u016f.<\/li>\n\n\n\n
  2. Ztr\u00e1ty na okraj\u00edch desti\u010dek<\/strong> - Desti\u010dky v bl\u00edzkosti kruhov\u00e9ho okraje desti\u010dky jsou \u010dasto nepou\u017eiteln\u00e9.<\/li>\n\n\n\n
  3. Hustota defekt\u016f<\/strong> - Ne v\u0161echny z\u00e1pustky jsou funk\u010dn\u00ed z d\u016fvodu v\u00fdrobn\u00edch vad.<\/li>\n\n\n\n
  4. Slo\u017eitost procesu<\/strong> - Slo\u017eit\u011bj\u0161\u00ed konstrukce mohou m\u00edrn\u011b sn\u00ed\u017eit v\u00fdt\u011b\u017enost.<\/li>\n<\/ol>\n\n\n\n

    3. Odhad po\u010dtu \u010dip\u016f na desti\u010dku<\/h2>\n\n\n\n

    Chcete-li odhadnout po\u010det \u010dip\u016f na desti\u010dku, postupujte podle n\u00e1sleduj\u00edc\u00edch krok\u016f:<\/p>\n\n\n\n

      \n
    1. V\u00fdpo\u010det plochy desti\u010dky<\/strong>: Plocha 300mm desti\u010dky je p\u0159ibli\u017en\u011b 70 685 mm\u00b2 (podle vzorce pro plochu kruhu: \u03c0 \u00d7 polom\u011br\u00b2, kde polom\u011br je 150 mm).<\/li>\n\n\n\n
    2. Zohledn\u011bn\u00ed ztr\u00e1t na hran\u00e1ch<\/strong>: P\u0159ibli\u017en\u011b 10% plochy desti\u010dky je obvykle nepou\u017eiteln\u00fdch v bl\u00edzkosti okraj\u016f. Vyu\u017eiteln\u00e1 plocha pak \u010din\u00ed p\u0159ibli\u017en\u011b 63 617 mm\u00b2.<\/li>\n\n\n\n
    3. D\u011blen\u00ed podle velikosti kostky<\/strong>: Pro standardn\u00ed desktopov\u00fd procesor Skylake s velikost\u00ed matrice 145 mm\u00b2 vyd\u011blte vyu\u017eitelnou plochu desti\u010dky velikost\u00ed matrice: 63 617 \u00f7 145 \u2248 438 \u010dip\u016f.<\/li>\n\n\n\n
    4. Faktor v\u00fdrobn\u00ed v\u00fdt\u011b\u017enosti<\/strong>: P\u0159i typick\u00e9m v\u00fdt\u011b\u017eku 85-90% je po\u010det funk\u010dn\u00edch \u010dip\u016f na desti\u010dku p\u0159ibli\u017en\u011b 1,5 milionu. 372-394<\/strong>.<\/li>\n<\/ol>\n\n\n\n
      \n

      Pozn\u00e1mka: Men\u0161\u00ed mobiln\u00ed \u010dipy Skylake mohou produkovat v\u00edce ne\u017e 500 \u010dip\u016f na desti\u010dku, zat\u00edmco v\u011bt\u0161\u00ed desktopov\u00e9 nebo serverov\u00e9 \u010dipy vy\u0161\u0161\u00ed t\u0159\u00eddy mohou produkovat m\u00e9n\u011b ne\u017e 350 funk\u010dn\u00edch \u010dip\u016f.<\/p>\n<\/blockquote>\n\n\n\n

      4. Pro\u010d je tento v\u00fdpo\u010det d\u016fle\u017eit\u00fd<\/h2>\n\n\n\n
        \n
      • Anal\u00fdza n\u00e1klad\u016f<\/strong>: V\u00fdt\u011b\u017enost wafer\u016f p\u0159\u00edmo ovliv\u0148uje v\u00fdrobn\u00ed n\u00e1klady na \u010dip. Vy\u0161\u0161\u00ed v\u00fdt\u011b\u017enost sni\u017euje n\u00e1klady a zvy\u0161uje ziskovost.<\/li>\n\n\n\n
      • Pl\u00e1nov\u00e1n\u00ed dodavatelsk\u00e9ho \u0159et\u011bzce<\/strong>: Znalost potenci\u00e1ln\u00ed produkce pom\u00e1h\u00e1 v\u00fdrobc\u016fm pl\u00e1novat objem v\u00fdroby a z\u00e1soby.<\/li>\n\n\n\n
      • \u0160k\u00e1lov\u00e1n\u00ed technologi\u00ed<\/strong>: Se zmen\u0161ov\u00e1n\u00edm polovodi\u010dov\u00fdch uzl\u016f (nap\u0159\u00edklad 10nm a 7nm) se zmen\u0161uje velikost matrice, co\u017e umo\u017e\u0148uje vyr\u00e1b\u011bt v\u00edce \u010dip\u016f na jeden pl\u00e1tek, ale slo\u017eitost procesu m\u016f\u017ee ovlivnit v\u00fdnosy.<\/li>\n<\/ul>\n\n\n\n

        5. \u00davahy z re\u00e1ln\u00e9ho sv\u011bta<\/h2>\n\n\n\n
          \n
        • Rozd\u00edly mezi modely<\/strong>: Mobiln\u00ed \u010dipy Skylake jsou men\u0161\u00ed a vyr\u00e1b\u011bj\u00ed v\u00edce matric na jeden wafer ne\u017e desktopov\u00e9 nebo serverov\u00e9 varianty.<\/li>\n\n\n\n
        • Vadn\u00e9 umrtvovac\u00ed hmoty<\/strong>: N\u011bkter\u00e9 matrice neprojdou kontrolou kvality a jsou nepou\u017eiteln\u00e9 nebo se prod\u00e1vaj\u00ed jako v\u00fdrobky ni\u017e\u0161\u00ed t\u0159\u00eddy.<\/li>\n\n\n\n
        • Budouc\u00ed trendy<\/strong>: Odv\u011btv\u00ed se posouv\u00e1 sm\u011brem k v\u011bt\u0161\u00ed desti\u010dky (450 mm)<\/strong> a pokro\u010dil\u00e9 balen\u00ed, co\u017e by mohlo v\u00fdrazn\u011b zv\u00fd\u0161it produkci na jeden wafer.<\/li>\n<\/ul>\n\n\n\n

          6. Z\u00e1v\u011br<\/h2>\n\n\n\n

          Odhad po\u010dtu \u010dip\u016f Skylake na 300mm desti\u010dce zahrnuje geometrii, statistiku v\u00fdt\u011b\u017enosti a anal\u00fdzu re\u00e1ln\u00fdch defekt\u016f. U standardn\u00edch matric Skylake pro stoln\u00ed po\u010d\u00edta\u010de (~145 mm\u00b2) lze na jednom 300mm pl\u00e1tku vyrobit p\u0159ibli\u017en\u011b 372-394 funk\u010dn\u00edch \u010dip\u016f. Pochopen\u00ed t\u00e9to metriky je kl\u00ed\u010dov\u00e9 pro modelov\u00e1n\u00ed n\u00e1klad\u016f, pl\u00e1nov\u00e1n\u00ed v\u00fdroby a progn\u00f3zov\u00e1n\u00ed v polovodi\u010dov\u00e9m pr\u016fmyslu.<\/p>\n\n\n\n

          D\u00edky pokroku v technologii v\u00fdroby desti\u010dek a litografie budou m\u00edt budouc\u00ed generace procesor\u016f vy\u0161\u0161\u00ed v\u00fdt\u011b\u017enost a efektivn\u011bj\u0161\u00ed v\u00fdrobu, \u010d\u00edm\u017e bude pokra\u010dovat rychl\u00e9 tempo po\u010d\u00edta\u010dov\u00fdch inovac\u00ed.<\/p>","protected":false},"excerpt":{"rendered":"

          The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch) […]<\/p>\n","protected":false},"author":2,"featured_media":8799,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uag_custom_page_level_css":"","footnotes":""},"categories":[27,12],"tags":[2167,2166,2169,2168,1225,1137,2165],"class_list":["post-8798","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-companynews","category-news","tag-300mm-wafer","tag-cpu-yield","tag-die-per-wafer","tag-intel-skylake","tag-semiconductor-manufacturing","tag-silicon-wafer","tag-skylake"],"acf":[],"uagb_featured_image_src":{"full":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-150x150.webp",150,150,true],"medium":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x225.webp",300,225,true],"medium_large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-768x576.webp",768,576,true],"large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-1024x769.webp",800,601,true],"1536x1536":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"2048x2048":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"trp-custom-language-flag":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-16x12.webp",16,12,true],"woocommerce_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x300.webp",300,300,true],"woocommerce_single":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-600x450.webp",600,450,true],"woocommerce_gallery_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-100x100.webp",100,100,true]},"uagb_author_info":{"display_name":"lydia","author_link":"https:\/\/www.sic-wafers.com\/cs\/author\/lydia\/"},"uagb_comment_info":0,"uagb_excerpt":"The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch)…","_links":{"self":[{"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/posts\/8798","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/comments?post=8798"}],"version-history":[{"count":1,"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/posts\/8798\/revisions"}],"predecessor-version":[{"id":8800,"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/posts\/8798\/revisions\/8800"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/media\/8799"}],"wp:attachment":[{"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/media?parent=8798"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/categories?post=8798"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/cs\/wp-json\/wp\/v2\/tags?post=8798"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}