{"id":8989,"date":"2026-07-08T14:34:25","date_gmt":"2026-07-08T06:34:25","guid":{"rendered":"https:\/\/www.sic-wafers.com\/?post_type=product&p=8989"},"modified":"2026-07-08T18:28:46","modified_gmt":"2026-07-08T10:28:46","slug":"through-via-sapphire-substrate-with-precision-micro-hole-arrays-for-advanced-packaging","status":"publish","type":"product","link":"https:\/\/www.sic-wafers.com\/fi\/product\/through-via-sapphire-substrate-with-precision-micro-hole-arrays-for-advanced-packaging\/","title":{"rendered":"Through-Via Sapphire Substrate with Precision Micro Hole Arrays for Advanced Packaging"},"content":{"rendered":"

\"\"Meid\u00e4n custom through-via sapphire substrates<\/strong> are manufactured from high-quality single crystal sapphire and processed according to customer drawings. The substrate can be made with round via holes, micro hole arrays, square windows, cavities, slots, and special patterns.<\/p>\n

The via structure can be used for vertical interconnection design, optical transmission, device alignment, packaging integration, sensor structure formation, and functional micro-device development. Different hole sizes, hole pitches, via quantities, substrate thicknesses, and external shapes can be customized to meet specific project requirements.<\/p>\n

Sapphire is especially suitable for demanding environments where the substrate must maintain high strength, stable geometry, good transparency, and resistance to heat, chemicals, and mechanical wear.<\/p>\n

\n

Key Benefits<\/h1>\n
\n
\n\n\n\n\n\n\n\n\n\n\n\n
Benefit<\/th>\nKuvaus<\/th>\n<\/tr>\n<\/thead>\n
High-Strength Sapphire<\/td>\nExcellent hardness, scratch resistance, and mechanical durability<\/td>\n<\/tr>\n
Precision Through-Via Processing<\/td>\nMicro holes, via arrays, alignment holes, and patterned openings available<\/td>\n<\/tr>\n
Optical Transparency<\/td>\nSuitable for optical inspection, sensing, and photonic applications<\/td>\n<\/tr>\n
Electrical Insulation<\/td>\nUseful for electronic, RF, and packaging-related substrate designs<\/td>\n<\/tr>\n
Thermal Stability<\/td>\nStable performance under elevated temperature conditions<\/td>\n<\/tr>\n
Kemiallinen kest\u00e4vyys<\/td>\nSuitable for harsh processing and corrosive environments<\/td>\n<\/tr>\n
Custom Geometry<\/td>\nRound wafers, square plates, rectangular substrates, and special shapes available<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
\n

Customizable Specifications<\/h1>\n
\n
\n\n\n\n\n\n\n\n\n\n\n\n\n\n
Kohde<\/th>\nAvailable Options<\/th>\n<\/tr>\n<\/thead>\n
Materiaali<\/td>\nSingle crystal sapphire \/ Al\u2082O\u2083<\/td>\n<\/tr>\n
Substrate Type<\/td>\nWafer, plate, window, patterned substrate<\/td>\n<\/tr>\n
Shape<\/td>\nRound, square, rectangular, custom shape<\/td>\n<\/tr>\n
Structure<\/td>\nThrough vias, micro holes, square openings, cavities, slots<\/td>\n<\/tr>\n
Hole Layout<\/td>\nSingle hole, multiple holes, dense array, custom pattern<\/td>\n<\/tr>\n
Pinnan viimeistely<\/td>\nSingle-side polished, double-side polished, custom finish<\/td>\n<\/tr>\n
Edge Treatment<\/td>\nChamfer, bevel, rounded edge, precision ground edge<\/td>\n<\/tr>\n
Processing Method<\/td>\nLaser drilling, cutting, grinding, polishing, pattern machining<\/td>\n<\/tr>\n
Production Type<\/td>\nPrototype, small batch, customized production<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n
\n

Typical Applications<\/h1>\n

Advanced Semiconductor Packaging<\/h2>\n

Through-via sapphire substrates can be used in packaging research, wafer-level packaging, interposer-like structures, alignment carriers, and vertical structure development.<\/p>\n

MEMS-laitteet<\/h2>\n

Precision micro holes and patterned openings make sapphire suitable for MEMS sensors, pressure sensing components, micro cavities, and microstructure platforms.<\/p>\n

Optical Sensors and Photonic Modules<\/h2>\n

With good transparency and high stability, sapphire can be used for optical windows, laser modules, imaging devices, photonic packaging, and inspection systems.<\/p>\n

High-Reliability Electronic Components<\/h2>\n

Sapphire offers strong electrical insulation and excellent dimensional stability, making it suitable for selected high-frequency, RF, and electronic module applications.<\/p>\n

R&D and Prototype Development<\/h2>\n

We support custom sapphire substrates for research projects, including small-batch samples, special via designs, unusual hole patterns, and customized substrate shapes.<\/p>\n

\n

\"\"Why Choose Sapphire for Through-Via Structures?<\/h1>\n

Sapphire is a single crystal aluminum oxide material known for its outstanding hardness and stable physical properties. For applications where ordinary glass may not provide enough strength or durability, sapphire offers a more robust substrate solution.<\/p>\n

It is particularly valuable when the application requires:<\/p>\n

High mechanical strength
Excellent scratch resistance
Stable optical performance
Strong chemical durability
Electrical insulation
Korkean l\u00e4mp\u00f6tilan vakaus
Precise microstructure processing
Customized hole and pattern design<\/p>\n

For demanding packaging, MEMS, optical, and sensor applications, sapphire can provide both functional performance and long-term reliability.<\/p>\n

\n

\"\"Manufacturing Capabilities<\/h1>\n

We provide customized sapphire substrate processing based on drawings, samples, or technical requirements.<\/p>\n

Our capabilities include:<\/p>\n

Sapphire wafer cutting
Sapphire plate shaping
Laser micro-hole drilling
Through-via array processing
Square window machining
Cavity and slot processing
Double-side polishing
Edge grinding and chamfering
Custom pattern fabrication
Prototype and batch production<\/p>\n

\n

Information Required for Quotation<\/h1>\n

To evaluate your project quickly, please provide the following details:<\/p>\n

Substrate material requirement
Wafer diameter or plate size
Paksuus
Hole diameter
Hole depth or through-hole requirement
Hole quantity
Hole pitch and layout
Surface polishing requirement
Dimensional tolerance
Edge treatment requirement
Quantity
Application background<\/p>\n

Drawings in PDF, DXF, CAD, STEP, or other technical formats are welcome.<\/p>\n

\n

FAQ<\/h1>\n

Q1: Is this a standard glass TGV substrate?<\/strong>
No. This product is made from sapphire. It uses TGV-style through-via structures, but the substrate material is single crystal sapphire, not ordinary glass.<\/p>\n

Q2: Can sapphire be processed with micro via holes?<\/strong>
Yes. Sapphire can be laser processed or precision machined to form micro holes, through vias, hole arrays, square openings, and other custom patterns.<\/p>\n

Q3: What shapes are available?<\/strong>
We can supply round sapphire wafers, square plates, rectangular substrates, and custom-shaped sapphire parts.<\/p>\n

Q4: Can you make both holes and square windows on the same substrate?<\/strong>
Yes. Different structures, such as circular holes, square windows, cavities, slots, and alignment holes, can be combined according to the drawing.<\/p>\n

Q5: Do you support prototype orders?<\/strong>
Yes. Prototype and small-batch production are available for R&D, testing, and design verification.<\/p>","protected":false},"excerpt":{"rendered":"

The through-via sapphire substrate<\/strong> is a customized sapphire wafer or plate processed with high-precision micro holes, through vias, alignment holes, square openings, and patterned structures. It is designed for applications that require excellent mechanical strength, optical transparency, electrical insulation, and long-term material stability.<\/p>\n

Although TGV is commonly associated with glass substrates, sapphire can also be processed into similar through-via structures for high-reliability applications. Compared with standard glass, sapphire provides superior hardness, stronger chemical resistance, better wear resistance, and excellent dimensional stability.<\/p>\n

This makes sapphire an ideal choice for advanced packaging, MEMS devices, optical sensors, photonic modules, microstructured components, and high-performance electronic applications.<\/p>","protected":false},"featured_media":8991,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_uag_custom_page_level_css":""},"product_brand":[],"product_cat":[1095,1084],"product_tag":[2585,2583,2592,2591,2586,2584,2587,2589,2593,2590,2582,2588,2581,2580,2579],"class_list":{"0":"post-8989","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-sapphire-wafer","7":"product_cat-sapphirealo","8":"product_tag-custom-sapphire-substrate","9":"product_tag-laser-drilled-sapphire-wafer","10":"product_tag-precision-sapphire-machining","11":"product_tag-sapphire-interposer-substrate","12":"product_tag-sapphire-mems-substrate","13":"product_tag-sapphire-micro-via-array","14":"product_tag-sapphire-optical-substrate","15":"product_tag-sapphire-patterned-substrate","16":"product_tag-sapphire-sensor-substrate","17":"product_tag-sapphire-substrate-for-advanced-packaging","18":"product_tag-sapphire-through-hole-substrate","19":"product_tag-sapphire-wafer-processing","20":"product_tag-sapphire-wafer-with-micro-holes","21":"product_tag-tgv-style-sapphire-substrate","22":"product_tag-through-via-sapphire-substrate","24":"first","25":"instock","26":"shipping-taxable","27":"product-type-simple"},"acf":[],"uagb_featured_image_src":{"full":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2.webp",1000,1000,false],"thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2-150x150.webp",150,150,true],"medium":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2-300x300.webp",300,300,true],"medium_large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2-768x768.webp",768,768,true],"large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2.webp",800,800,false],"1536x1536":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2.webp",1000,1000,false],"2048x2048":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2.webp",1000,1000,false],"trp-custom-language-flag":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2-12x12.webp",12,12,true],"woocommerce_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2-300x300.webp",300,300,true],"woocommerce_single":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2-600x600.webp",600,600,true],"woocommerce_gallery_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/07\/Through-Via-Sapphire-Substrate-with-Precision-Micro-Hole-Arrays-for-Advanced-Packaging-2-100x100.webp",100,100,true]},"uagb_author_info":{"display_name":"lydia","author_link":"https:\/\/www.sic-wafers.com\/fi\/author\/"},"uagb_comment_info":1,"uagb_excerpt":"The through-via sapphire substrate is a customized sapphire wafer or plate processed with high-precision micro holes, through vias, alignment holes, square openings, and patterned structures. It is designed for applications that require excellent mechanical strength, optical transparency, electrical insulation, and long-term material stability. Although TGV is commonly associated with glass substrates, sapphire can also be…","_links":{"self":[{"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/product\/8989","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/comments?post=8989"}],"version-history":[{"count":3,"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/product\/8989\/revisions"}],"predecessor-version":[{"id":8995,"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/product\/8989\/revisions\/8995"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/media\/8991"}],"wp:attachment":[{"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/media?parent=8989"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/product_brand?post=8989"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/product_cat?post=8989"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/fi\/wp-json\/wp\/v2\/product_tag?post=8989"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}