{"id":8798,"date":"2026-04-02T11:41:33","date_gmt":"2026-04-02T03:41:33","guid":{"rendered":"https:\/\/www.sic-wafers.com\/?p=8798"},"modified":"2026-04-02T11:41:44","modified_gmt":"2026-04-02T03:41:44","slug":"how-many-skylake-chips-can-be-produced-on-a-300mm-wafer","status":"publish","type":"post","link":"https:\/\/www.sic-wafers.com\/hu\/how-many-skylake-chips-can-be-produced-on-a-300mm-wafer\/","title":{"rendered":"H\u00e1ny Skylake chip gy\u00e1rthat\u00f3 egy 300 mm-es osty\u00e1n?"},"content":{"rendered":"
<\/div>\n

A modern mikroprocesszorok, p\u00e9ld\u00e1ul az Intel Skylake sorozat\u00e1nak gy\u00e1rt\u00e1sa nagym\u00e9ret\u0171 szil\u00edciumlapk\u00e1kkal kezd\u0151dik. A f\u00e9lvezet\u0151gy\u00e1rt\u00f3k, a hardvertervez\u0151k \u00e9s az ipar\u00e1gi elemz\u0151k sz\u00e1m\u00e1ra kulcsfontoss\u00e1g\u00fa annak meg\u00e9rt\u00e9se, hogy egyetlen osty\u00e1b\u00f3l h\u00e1ny chipet lehet el\u0151\u00e1ll\u00edtani. Ebben a cikkben azokat a t\u00e9nyez\u0151ket vizsg\u00e1ljuk meg, amelyek meghat\u00e1rozz\u00e1k, hogy h\u00e1ny Skylake chipet lehet el\u0151\u00e1ll\u00edtani egy szabv\u00e1nyos, 300 mm-es (12 h\u00fcvelykes) szil\u00edcium ostya<\/a>, az ipar\u00e1gi legjobb gyakorlatok alkalmaz\u00e1s\u00e1val.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

1. Bevezet\u00e9s a Skylake architekt\u00far\u00e1ba<\/h2>\n\n\n\n

A Skylake az Intel 2015-ben bevezetett 6. gener\u00e1ci\u00f3s Core mikroarchitekt\u00far\u00e1ja. Ez 14 nm-es FinFET technol\u00f3gi\u00e1val k\u00e9sz\u00fcl, t\u00f6bb magot, Hyper-Threadinget \u00e9s integr\u00e1lt grafik\u00e1t t\u00e1mogat. A Skylake processzor a modellt\u0151l f\u00fcgg\u0151en a k\u00e9tmagos mobilchipekt\u0151l a n\u00e9gy- vagy hatmagos asztali CPU-kig terjedhet, a lapkam\u00e9ret pedig jellemz\u0151en 122 mm\u00b2 \u00e9s 151 mm\u00b2 k\u00f6z\u00f6tt mozog.<\/p>\n\n\n\n

A chipek m\u00e9rete kritikus, mivel k\u00f6zvetlen\u00fcl befoly\u00e1solja az egyetlen osty\u00e1b\u00f3l el\u0151\u00e1ll\u00edthat\u00f3 chipek sz\u00e1m\u00e1t.<\/p>\n\n\n\n

2. A Wafer Yield meg\u00e9rt\u00e9se<\/h2>\n\n\n\n

A 300 mm-es szil\u00edcium ostya<\/strong> a modern f\u00e9lvezet\u0151gy\u00e1rt\u00e1s szabv\u00e1nya, amely nagy \u00e1tereszt\u0151k\u00e9pess\u00e9get \u00e9s alacsonyabb chipenk\u00e9nti k\u00f6lts\u00e9get biztos\u00edt. Az egy osty\u00e1ra jut\u00f3 chipek teljes sz\u00e1ma azonban t\u00f6bb t\u00e9nyez\u0151t\u0151l f\u00fcgg:<\/p>\n\n\n\n

    \n
  1. Szersz\u00e1mm\u00e9ret<\/strong> - A nagyobb lapk\u00e1k nagyobb fel\u00fcletet foglalnak el, ami cs\u00f6kkenti a chipek teljes sz\u00e1m\u00e1t.<\/li>\n\n\n\n
  2. Wafer Edge vesztes\u00e9gek<\/strong> - Az ostya k\u00f6r alak\u00fa sz\u00e9l\u00e9hez k\u00f6zeli szersz\u00e1mok gyakran haszn\u00e1lhatatlanok.<\/li>\n\n\n\n
  3. Hibas\u0171r\u0171s\u00e9g<\/strong> - A gy\u00e1rt\u00e1si hib\u00e1k miatt nem minden szersz\u00e1m m\u0171k\u00f6d\u0151k\u00e9pes.<\/li>\n\n\n\n
  4. Folyamat bonyolults\u00e1ga<\/strong> - Az \u00f6sszetettebb konstrukci\u00f3k kiss\u00e9 cs\u00f6kkenthetik a hozamot.<\/li>\n<\/ol>\n\n\n\n

    3. A lapk\u00e1nk\u00e9nti chipek sz\u00e1m\u00e1nak becsl\u00e9se<\/h2>\n\n\n\n

    A k\u00f6vetkez\u0151 l\u00e9p\u00e9seket k\u00f6vetve becs\u00fclje meg a chipek sz\u00e1m\u00e1t osty\u00e1nk\u00e9nt:<\/p>\n\n\n\n

      \n
    1. Sz\u00e1m\u00edtsa ki az ostya ter\u00fclet\u00e9t<\/strong>: Egy 300 mm-es ostya ter\u00fclete k\u00f6r\u00fclbel\u00fcl 70,685 mm\u00b2 (a k\u00f6r ter\u00fclet\u00e9re vonatkoz\u00f3 k\u00e9pletet haszn\u00e1lva: \u03c0 \u00d7 sug\u00e1r\u00b2, ahol a sug\u00e1r 150 mm).<\/li>\n\n\n\n
    2. Az \u00e9lvesztes\u00e9gek elsz\u00e1mol\u00e1sa<\/strong>: Az ostya ter\u00fclet\u00e9nek kb. 10%-je jellemz\u0151en a sz\u00e9lek k\u00f6zel\u00e9ben haszn\u00e1lhatatlan. A felhaszn\u00e1lhat\u00f3 ter\u00fclet ekkor k\u00f6r\u00fclbel\u00fcl 63,617 mm\u00b2.<\/li>\n\n\n\n
    3. Ossza el a kocka m\u00e9ret\u00e9vel<\/strong>: Egy szabv\u00e1nyos Skylake asztali CPU eset\u00e9ben, amelynek lapkam\u00e9rete 145 mm\u00b2, ossza el a felhaszn\u00e1lhat\u00f3 ostyater\u00fcletet a lapka m\u00e9ret\u00e9vel: 63 617 \u00f7 145 \u2248 438 chip.<\/li>\n\n\n\n
    4. A gy\u00e1rt\u00e1si hozam t\u00e9nyez\u0151je<\/strong>: 85-90% tipikus hozam mellett a funkcion\u00e1lis chipek sz\u00e1ma osty\u00e1nk\u00e9nt kb. 372-394<\/strong>.<\/li>\n<\/ol>\n\n\n\n
      \n

      Megjegyz\u00e9s: A kisebb Skylake mobil lapk\u00e1k t\u00f6bb mint 500 chipet \u00e1ll\u00edthatnak el\u0151 lapk\u00e1nk\u00e9nt, m\u00edg a nagyobb cs\u00facskateg\u00f3ri\u00e1s asztali vagy szerver lapk\u00e1k kevesebb mint 350 funkcion\u00e1lis chipet \u00e1ll\u00edthatnak el\u0151.<\/p>\n<\/blockquote>\n\n\n\n

      4. Mi\u00e9rt fontos ez a sz\u00e1m\u00edt\u00e1s<\/h2>\n\n\n\n
        \n
      • K\u00f6lts\u00e9gelemz\u00e9s<\/strong>: Az ostyahozam k\u00f6zvetlen\u00fcl befoly\u00e1solja a chipenk\u00e9nti gy\u00e1rt\u00e1si k\u00f6lts\u00e9get. A magasabb hozam cs\u00f6kkenti a k\u00f6lts\u00e9geket \u00e9s n\u00f6veli a nyeres\u00e9gess\u00e9get.<\/li>\n\n\n\n
      • Ell\u00e1t\u00e1si l\u00e1nc tervez\u00e9s<\/strong>: A potenci\u00e1lis kibocs\u00e1t\u00e1s ismerete seg\u00edt a gy\u00e1rt\u00f3knak a termel\u00e9si mennyis\u00e9gek \u00e9s a k\u00e9szletek tervez\u00e9s\u00e9ben.<\/li>\n\n\n\n
      • Technol\u00f3giai m\u00e9retez\u00e9s<\/strong>: A f\u00e9lvezet\u0151csom\u00f3pontok zsugorod\u00e1s\u00e1val (p\u00e9ld\u00e1ul 10 nm \u00e9s 7 nm) a lapk\u00e1k m\u00e9rete cs\u00f6kken, ami t\u00f6bb chipet tesz lehet\u0151v\u00e9 egy osty\u00e1n, de a folyamat bonyolults\u00e1ga befoly\u00e1solhatja a hozamokat.<\/li>\n<\/ul>\n\n\n\n

        5. Val\u00f3s vil\u00e1gbeli megfontol\u00e1sok<\/h2>\n\n\n\n
          \n
        • Modellenk\u00e9nti elt\u00e9r\u00e9sek<\/strong>: A mobil Skylake chipek kisebbek, \u00e9s t\u00f6bb lapk\u00e1t gy\u00e1rtanak egy osty\u00e1ra, mint az asztali vagy szerver v\u00e1ltozatok.<\/li>\n\n\n\n
        • Hib\u00e1s szersz\u00e1mok<\/strong>: Egyes szersz\u00e1mok nem felelnek meg a min\u0151s\u00e9gellen\u0151rz\u00e9snek, \u00e9s haszn\u00e1lhatatlanok, vagy alacsonyabb szint\u0171 term\u00e9kk\u00e9nt ker\u00fclnek forgalomba.<\/li>\n\n\n\n
        • J\u00f6v\u0151beli trendek<\/strong>: Az ipar\u00e1g a k\u00f6vetkez\u0151 ir\u00e1nyba mozdul el nagyobb osty\u00e1k (450 mm)<\/strong> \u00e9s a fejlett csomagol\u00e1st, ami jelent\u0151sen n\u00f6velheti az egy osty\u00e1ra jut\u00f3 teljes\u00edtm\u00e9nyt.<\/li>\n<\/ul>\n\n\n\n

          6. K\u00f6vetkeztet\u00e9s<\/h2>\n\n\n\n

          A 300 mm-es osty\u00e1n elhelyezett Skylake chipek sz\u00e1m\u00e1nak becsl\u00e9se mag\u00e1ban foglalja a geometri\u00e1t, a hozamstatisztik\u00e1kat \u00e9s a val\u00f3s hib\u00e1k elemz\u00e9s\u00e9t. A szabv\u00e1nyos asztali Skylake lapk\u00e1k (~145 mm\u00b2) eset\u00e9ben egyetlen 300 mm-es ostya k\u00f6r\u00fclbel\u00fcl 372-394 funkcion\u00e1lis chipet k\u00e9pes el\u0151\u00e1ll\u00edtani. Ennek a m\u00e9r\u0151sz\u00e1mnak a meg\u00e9rt\u00e9se kulcsfontoss\u00e1g\u00fa a k\u00f6lts\u00e9gmodellez\u00e9s, a gy\u00e1rt\u00e1stervez\u00e9s \u00e9s az el\u0151rejelz\u00e9s szempontj\u00e1b\u00f3l a f\u00e9lvezet\u0151iparban.<\/p>\n\n\n\n

          Az ostyatechnol\u00f3gia \u00e9s a litogr\u00e1fia fejl\u0151d\u00e9s\u00e9vel a CPU-k j\u00f6v\u0151beli gener\u00e1ci\u00f3i nagyobb hozamot \u00e9s hat\u00e9konyabb gy\u00e1rt\u00e1st fognak el\u00e9rni, folytatva a sz\u00e1m\u00edt\u00e1stechnikai innov\u00e1ci\u00f3 gyors \u00fctem\u00e9t.<\/p>","protected":false},"excerpt":{"rendered":"

          The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch) […]<\/p>\n","protected":false},"author":2,"featured_media":8799,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uag_custom_page_level_css":"","footnotes":""},"categories":[27,12],"tags":[2167,2166,2169,2168,1225,1137,2165],"class_list":["post-8798","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-companynews","category-news","tag-300mm-wafer","tag-cpu-yield","tag-die-per-wafer","tag-intel-skylake","tag-semiconductor-manufacturing","tag-silicon-wafer","tag-skylake"],"acf":[],"uagb_featured_image_src":{"full":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-150x150.webp",150,150,true],"medium":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x225.webp",300,225,true],"medium_large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-768x576.webp",768,576,true],"large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-1024x769.webp",800,601,true],"1536x1536":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"2048x2048":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"trp-custom-language-flag":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-16x12.webp",16,12,true],"woocommerce_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x300.webp",300,300,true],"woocommerce_single":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-600x450.webp",600,450,true],"woocommerce_gallery_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-100x100.webp",100,100,true]},"uagb_author_info":{"display_name":"lydia","author_link":"https:\/\/www.sic-wafers.com\/hu\/author\/lydia\/"},"uagb_comment_info":0,"uagb_excerpt":"The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch)…","_links":{"self":[{"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/posts\/8798","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/comments?post=8798"}],"version-history":[{"count":1,"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/posts\/8798\/revisions"}],"predecessor-version":[{"id":8800,"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/posts\/8798\/revisions\/8800"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/media\/8799"}],"wp:attachment":[{"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/media?parent=8798"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/categories?post=8798"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/hu\/wp-json\/wp\/v2\/tags?post=8798"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}