{"id":8798,"date":"2026-04-02T11:41:33","date_gmt":"2026-04-02T03:41:33","guid":{"rendered":"https:\/\/www.sic-wafers.com\/?p=8798"},"modified":"2026-04-02T11:41:44","modified_gmt":"2026-04-02T03:41:44","slug":"how-many-skylake-chips-can-be-produced-on-a-300mm-wafer","status":"publish","type":"post","link":"https:\/\/www.sic-wafers.com\/sv\/how-many-skylake-chips-can-be-produced-on-a-300mm-wafer\/","title":{"rendered":"Hur m\u00e5nga Skylake-chip kan tillverkas p\u00e5 en 300 mm skiva?"},"content":{"rendered":"
<\/div>\n

Tillverkningen av moderna mikroprocessorer, som Intels Skylake-serie, b\u00f6rjar med stora kiselskivor. Att f\u00f6rst\u00e5 hur m\u00e5nga chip en enda kiselskiva kan ge \u00e4r avg\u00f6rande f\u00f6r halvledartillverkare, h\u00e5rdvarudesigners och branschanalytiker. I den h\u00e4r artikeln kommer vi att unders\u00f6ka de faktorer som avg\u00f6r antalet Skylake-chip som produceras fr\u00e5n en standard 300 mm (12 tum) kiselskiva<\/a>, med hj\u00e4lp av b\u00e4sta praxis inom branschen.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

1. Introduktion till Skylake-arkitekturen<\/h2>\n\n\n\n

Skylake \u00e4r Intels 6:e generationens Core-mikroarkitektur som introducerades 2015. Den tillverkas med 14 nm FinFET-teknik och har st\u00f6d f\u00f6r flera k\u00e4rnor, Hyper-Threading och integrerad grafik. Beroende p\u00e5 modell kan en Skylake-processor vara allt fr\u00e5n ett dubbelk\u00e4rnigt mobilchip till en fyrk\u00e4rnig eller sexk\u00e4rnig station\u00e4r CPU, med en chipstorlek p\u00e5 mellan 122 mm\u00b2 och 151 mm\u00b2.<\/p>\n\n\n\n

Chipstorleken \u00e4r kritisk eftersom den direkt p\u00e5verkar antalet chip som kan produceras fr\u00e5n en och samma wafer.<\/p>\n\n\n\n

2. F\u00f6rst\u00e5else f\u00f6r Wafer Yield<\/h2>\n\n\n\n

A 300 mm kiselskiva<\/strong> \u00e4r standard i modern halvledartillverkning och ger h\u00f6g genomstr\u00f6mning och l\u00e4gre kostnad per chip. Det totala antalet chip per wafer beror dock p\u00e5 flera faktorer:<\/p>\n\n\n\n

    \n
  1. Storlek p\u00e5 munstycke<\/strong> - St\u00f6rre chips tar upp mer waferyta, vilket minskar det totala antalet chips.<\/li>\n\n\n\n
  2. F\u00f6rluster p\u00e5 waferkanten<\/strong> - Matriklar n\u00e4ra den cirkul\u00e4ra kanten p\u00e5 skivan \u00e4r ofta oanv\u00e4ndbara.<\/li>\n\n\n\n
  3. Defekt densitet<\/strong> - Alla verktyg \u00e4r inte funktionella p\u00e5 grund av tillverkningsfel.<\/li>\n\n\n\n
  4. Processens komplexitet<\/strong> - Mer komplexa konstruktioner kan s\u00e4nka avkastningen n\u00e5got.<\/li>\n<\/ol>\n\n\n\n

    3. Uppskattning av antalet chips per wafer<\/h2>\n\n\n\n

    F\u00f6lj dessa steg f\u00f6r att uppskatta antalet chips per wafer:<\/p>\n\n\n\n

      \n
    1. Ber\u00e4kna waferarean<\/strong>: Arean p\u00e5 en 300 mm wafer \u00e4r cirka 70.685 mm\u00b2 (med formeln f\u00f6r arean p\u00e5 en cirkel: \u03c0 \u00d7 radie\u00b2, d\u00e4r radien \u00e4r 150 mm).<\/li>\n\n\n\n
    2. Redovisning av kantf\u00f6rluster<\/strong>: Cirka 10% av waferytan \u00e4r typiskt oanv\u00e4ndbar n\u00e4ra kanterna. Den anv\u00e4ndbara ytan \u00e4r d\u00e5 cirka 63.617 mm\u00b2.<\/li>\n\n\n\n
    3. Dividera med matrisstorlek<\/strong>: F\u00f6r en standard Skylake desktop CPU med en chipstorlek p\u00e5 145 mm\u00b2, dividera den anv\u00e4ndbara waferytan med chipstorleken: 63.617 \u00f7 145 \u2248 438 chips.<\/li>\n\n\n\n
    4. Faktor i tillverkningsutbyte<\/strong>: Med typiska utbyten p\u00e5 85-90% \u00e4r antalet funktionella chips per wafer ungef\u00e4r 372-394<\/strong>.<\/li>\n<\/ol>\n\n\n\n
      \n

      Obs: Mindre Skylake-mobilchips kan producera \u00f6ver 500 chip per skiva, medan st\u00f6rre high-end-chips f\u00f6r station\u00e4ra datorer eller servrar kan producera f\u00e4rre \u00e4n 350 funktionella chip.<\/p>\n<\/blockquote>\n\n\n\n

      4. Varf\u00f6r denna ber\u00e4kning \u00e4r viktig<\/h2>\n\n\n\n
        \n
      • Kostnadsanalys<\/strong>: Wafer yield har en direkt inverkan p\u00e5 tillverkningskostnaden per chip. H\u00f6gre utbyte minskar kostnaderna och \u00f6kar l\u00f6nsamheten.<\/li>\n\n\n\n
      • Planering av f\u00f6rs\u00f6rjningskedjan<\/strong>: Att k\u00e4nna till den potentiella produktionen hj\u00e4lper tillverkarna att planera produktionsvolymer och lager.<\/li>\n\n\n\n
      • Skalning av teknik<\/strong>: I takt med att halvledarnoderna krymper (t.ex. 10 nm och 7 nm) minskar storleken p\u00e5 chipen, vilket m\u00f6jligg\u00f6r fler chip per wafer, men processkomplexiteten kan p\u00e5verka utbytet.<\/li>\n<\/ul>\n\n\n\n

        5. \u00d6verv\u00e4ganden i den verkliga v\u00e4rlden<\/h2>\n\n\n\n
          \n
        • Variation mellan olika modeller<\/strong>: Mobile Skylake-chip \u00e4r mindre och producerar fler dies per wafer \u00e4n desktop- eller servervarianterna.<\/li>\n\n\n\n
        • Defekta matriser<\/strong>: Vissa matriser klarar inte kvalitetskontroller och \u00e4r oanv\u00e4ndbara eller s\u00e4ljs som produkter av l\u00e4gre kvalitet.<\/li>\n\n\n\n
        • Framtida trender<\/strong>: Branschen \u00e4r p\u00e5 v\u00e4g mot st\u00f6rre wafers (450 mm)<\/strong> och avancerad paketering, vilket kan \u00f6ka produktionen per wafer avsev\u00e4rt.<\/li>\n<\/ul>\n\n\n\n

          6. Slutsatser<\/h2>\n\n\n\n

          F\u00f6r att uppskatta antalet Skylake-chip p\u00e5 en 300 mm skiva kr\u00e4vs geometri, utbytesstatistik och analys av defekter i verkligheten. F\u00f6r Skylake-chips f\u00f6r station\u00e4ra standarddatorer (~145 mm\u00b2) kan en enda 300 mm skiva producera cirka 372-394 funktionella chips. Att f\u00f6rst\u00e5 detta m\u00e5tt \u00e4r avg\u00f6rande f\u00f6r kostnadsmodellering, produktionsplanering och prognoser inom halvledarindustrin.<\/p>\n\n\n\n

          Med framsteg inom waferteknik och litografi kommer framtida generationer av processorer att f\u00e5 h\u00f6gre utbyte och effektivare tillverkning, vilket kommer att forts\u00e4tta den snabba takten i datorutvecklingen.<\/p>","protected":false},"excerpt":{"rendered":"

          The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch) […]<\/p>\n","protected":false},"author":2,"featured_media":8799,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uag_custom_page_level_css":"","footnotes":""},"categories":[27,12],"tags":[2167,2166,2169,2168,1225,1137,2165],"class_list":["post-8798","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-companynews","category-news","tag-300mm-wafer","tag-cpu-yield","tag-die-per-wafer","tag-intel-skylake","tag-semiconductor-manufacturing","tag-silicon-wafer","tag-skylake"],"acf":[],"uagb_featured_image_src":{"full":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-150x150.webp",150,150,true],"medium":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x225.webp",300,225,true],"medium_large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-768x576.webp",768,576,true],"large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-1024x769.webp",800,601,true],"1536x1536":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"2048x2048":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"trp-custom-language-flag":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-16x12.webp",16,12,true],"woocommerce_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x300.webp",300,300,true],"woocommerce_single":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-600x450.webp",600,450,true],"woocommerce_gallery_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-100x100.webp",100,100,true]},"uagb_author_info":{"display_name":"lydia","author_link":"https:\/\/www.sic-wafers.com\/sv\/author\/lydia\/"},"uagb_comment_info":0,"uagb_excerpt":"The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch)…","_links":{"self":[{"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/posts\/8798","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/comments?post=8798"}],"version-history":[{"count":1,"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/posts\/8798\/revisions"}],"predecessor-version":[{"id":8800,"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/posts\/8798\/revisions\/8800"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/media\/8799"}],"wp:attachment":[{"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/media?parent=8798"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/categories?post=8798"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/sv\/wp-json\/wp\/v2\/tags?post=8798"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}