300mm High-Thermal-Conductivity SiC Substrates for AI/HPC Packaging: Thermal Conductivity, Flatness, Thickness and Bonding Requirements
Artificial intelligence accelerators and high-performance computing processors are creating a thermal-management problem that can no longer be solved only by improving external heat sinks or cooling systems. As GPU, accelerator, HBM and chiplet integration becomes denser, a growing portion of the thermal challenge is moving inside the semiconductor package itself. The material directly beneath or […]