300mm High-Thermal-Conductivity SiC Substrates for AI/HPC Packaging: Thermal Conductivity, Flatness, Thickness and Bonding Requirements
Artificial intelligence accelerators and high-performance computing processors are creating a thermal-management problem that can no longer be solved only by improving external heat sinks or cooling systems. As GPU, accelerator, HBM and chiplet integration becomes denser, a growing portion of the thermal challenge is moving inside the semiconductor package itself. The material directly beneath or […]
Five Semiconductor Material Trends in 2026: From Silicon to the Leap of Third-Generation Semiconductors
In 2026, the semiconductor materials industry is at a historical turning point. Silicon, the backbone of the semiconductor industry, is approaching its physical limits, while next-generation wide-bandgap materials such as silicon carbide (SiC) and gallium nitride (GaN) are rapidly emerging, driving high-performance advancements in power electronics, RF communication, optoelectronics, and electric vehicles. This article systematically […]