Silicon Carbide (SiC) Wafer Dicing and Cutting Methods: Technologies, Challenges, and Future Trends
1. Introduction The manufacturing of silicon carbide (SiC) power devices involves highly complex semiconductor processes, typically consisting of hundreds of steps. These processes can be broadly divided into: Among them, wafer dicing (cutting and singulation) plays a critical role as the bridge between front-end processing and back-end packaging. As device miniaturization and integration continue to […]