{"id":8798,"date":"2026-04-02T11:41:33","date_gmt":"2026-04-02T03:41:33","guid":{"rendered":"https:\/\/www.sic-wafers.com\/?p=8798"},"modified":"2026-04-02T11:41:44","modified_gmt":"2026-04-02T03:41:44","slug":"how-many-skylake-chips-can-be-produced-on-a-300mm-wafer","status":"publish","type":"post","link":"https:\/\/www.sic-wafers.com\/tr\/how-many-skylake-chips-can-be-produced-on-a-300mm-wafer\/","title":{"rendered":"300mm Gofret \u00dczerinde Ka\u00e7 Adet Skylake Yongas\u0131 \u00dcretilebilir?"},"content":{"rendered":"
<\/div>\n

Intel'in Skylake serisi gibi modern mikroi\u015flemcilerin \u00fcretimi b\u00fcy\u00fck silikon yonga plakalar\u0131 ile ba\u015flar. Tek bir yonga plakas\u0131n\u0131n ka\u00e7 yonga \u00fcretebilece\u011fini anlamak yar\u0131 iletken \u00fcreticileri, donan\u0131m tasar\u0131mc\u0131lar\u0131 ve sekt\u00f6r analistleri i\u00e7in \u00e7ok \u00f6nemlidir. Bu makalede, standart bir 300 mm (12 in\u00e7) yonga plakas\u0131ndan \u00fcretilen Skylake yongalar\u0131n\u0131n say\u0131s\u0131n\u0131 belirleyen fakt\u00f6rleri inceleyece\u011fiz. silikon gofret<\/a>, sekt\u00f6rdeki en iyi uygulamalar\u0131 kullanarak.<\/p>\n\n\n\n

\"\"<\/figure>\n\n\n\n

1. Skylake Mimarisine Giri\u015f<\/h2>\n\n\n\n

Skylake, Intel'in 2015 y\u0131l\u0131nda tan\u0131t\u0131lan 6. nesil Core mikro mimarisidir. Birden fazla \u00e7ekirde\u011fi, Hyper-Threading'i ve entegre grafikleri destekleyen 14nm FinFET teknolojisi kullan\u0131larak \u00fcretilmi\u015ftir. Skylake i\u015flemci, modele ba\u011fl\u0131 olarak \u00e7ift \u00e7ekirdekli mobil \u00e7ipten d\u00f6rt \u00e7ekirdekli veya alt\u0131 \u00e7ekirdekli masa\u00fcst\u00fc CPU'ya kadar de\u011fi\u015febilir ve kal\u0131p boyutlar\u0131 tipik olarak 122 mm\u00b2 ile 151 mm\u00b2 aras\u0131ndad\u0131r.<\/p>\n\n\n\n

Bir \u00e7ipin kal\u0131p boyutu kritiktir \u00e7\u00fcnk\u00fc tek bir yonga plakas\u0131ndan \u00fcretilebilecek \u00e7ip say\u0131s\u0131n\u0131 do\u011frudan etkiler.<\/p>\n\n\n\n

2. Gofret Verimini Anlamak<\/h2>\n\n\n\n

A 300 mm silikon gofret<\/strong> modern yar\u0131 iletken \u00fcretiminde standartt\u0131r, y\u00fcksek verim ve \u00e7ip ba\u015f\u0131na daha d\u00fc\u015f\u00fck maliyet sunar. Ancak yonga plakas\u0131 ba\u015f\u0131na d\u00fc\u015fen toplam \u00e7ip say\u0131s\u0131 \u00e7e\u015fitli fakt\u00f6rlere ba\u011fl\u0131d\u0131r:<\/p>\n\n\n\n

    \n
  1. Kal\u0131p Boyutu<\/strong> - Daha b\u00fcy\u00fck kal\u0131plar daha fazla yonga plakas\u0131 alan\u0131 kaplayarak toplam yonga say\u0131s\u0131n\u0131 azalt\u0131r.<\/li>\n\n\n\n
  2. Wafer Kenar Kay\u0131plar\u0131<\/strong> - Gofretin dairesel kenar\u0131na yak\u0131n kal\u0131plar genellikle kullan\u0131lamaz.<\/li>\n\n\n\n
  3. Kusur Yo\u011funlu\u011fu<\/strong> - \u0130malat hatalar\u0131 nedeniyle t\u00fcm kal\u0131plar i\u015flevsel de\u011fildir.<\/li>\n\n\n\n
  4. S\u00fcre\u00e7 Karma\u015f\u0131kl\u0131\u011f\u0131<\/strong> - Daha karma\u015f\u0131k tasar\u0131mlar verimi biraz d\u00fc\u015f\u00fcrebilir.<\/li>\n<\/ol>\n\n\n\n

    3. Gofret Ba\u015f\u0131na \u00c7ip Say\u0131s\u0131n\u0131n Tahmin Edilmesi<\/h2>\n\n\n\n

    Gofret ba\u015f\u0131na \u00e7ip say\u0131s\u0131n\u0131 tahmin etmek i\u00e7in a\u015fa\u011f\u0131daki ad\u0131mlar\u0131 izleyin:<\/p>\n\n\n\n

      \n
    1. Gofret alan\u0131n\u0131 hesaplay\u0131n<\/strong>: 300 mm'lik bir gofretin alan\u0131 yakla\u015f\u0131k 70.685 mm\u00b2'dir (bir dairenin alan\u0131 i\u00e7in form\u00fcl\u00fc kullanarak: \u03c0 \u00d7 yar\u0131\u00e7ap\u00b2, burada yar\u0131\u00e7ap 150 mm'dir).<\/li>\n\n\n\n
    2. Kenar kay\u0131plar\u0131n\u0131 hesaba kat\u0131n<\/strong>: Wafer alan\u0131n\u0131n yakla\u015f\u0131k 10%'si tipik olarak kenarlara yak\u0131n yerlerde kullan\u0131lamaz. Bu durumda kullan\u0131labilir alan yakla\u015f\u0131k 63,617 mm\u00b2'dir.<\/li>\n\n\n\n
    3. Kal\u0131p boyutuna g\u00f6re b\u00f6l\u00fcn<\/strong>: Kal\u0131p boyutu 145 mm\u00b2 olan standart bir Skylake masa\u00fcst\u00fc CPU i\u00e7in kullan\u0131labilir yonga plakas\u0131 alan\u0131n\u0131 kal\u0131p boyutuna b\u00f6l\u00fcn: 63.617 \u00f7 145 \u2248 438 yonga.<\/li>\n\n\n\n
    4. \u00dcretim verimi fakt\u00f6r\u00fc<\/strong>: Tipik 85-90% verimle, gofret ba\u015f\u0131na i\u015flevsel yonga say\u0131s\u0131 yakla\u015f\u0131k olarak 372-394<\/strong>.<\/li>\n<\/ol>\n\n\n\n
      \n

      Not: Daha k\u00fc\u00e7\u00fck Skylake mobil kal\u0131plar\u0131 yonga plakas\u0131 ba\u015f\u0131na 500'den fazla yonga \u00fcretebilirken, daha b\u00fcy\u00fck \u00fcst d\u00fczey masa\u00fcst\u00fc veya sunucu kal\u0131plar\u0131 350'den az i\u015flevsel yonga \u00fcretebilir.<\/p>\n<\/blockquote>\n\n\n\n

      4. Bu Hesaplama Neden \u00d6nemlidir?<\/h2>\n\n\n\n
        \n
      • Maliyet Analizi<\/strong>: Wafer verimi \u00e7ip ba\u015f\u0131na \u00fcretim maliyetini do\u011frudan etkiler. Daha y\u00fcksek verim maliyeti d\u00fc\u015f\u00fcr\u00fcr ve karl\u0131l\u0131\u011f\u0131 art\u0131r\u0131r.<\/li>\n\n\n\n
      • Tedarik Zinciri Planlamas\u0131<\/strong>: Potansiyel \u00e7\u0131kt\u0131n\u0131n bilinmesi, \u00fcreticilerin \u00fcretim hacimlerini ve envanterlerini planlamalar\u0131na yard\u0131mc\u0131 olur.<\/li>\n\n\n\n
      • Teknoloji \u00d6l\u00e7eklendirme<\/strong>: Yar\u0131 iletken d\u00fc\u011f\u00fcmleri k\u00fc\u00e7\u00fcld\u00fck\u00e7e (\u00f6rne\u011fin, 10nm ve 7nm), kal\u0131p boyutlar\u0131 k\u00fc\u00e7\u00fclerek yonga plakas\u0131 ba\u015f\u0131na daha fazla yongaya izin verir, ancak s\u00fcre\u00e7 karma\u015f\u0131kl\u0131\u011f\u0131 verimi etkileyebilir.<\/li>\n<\/ul>\n\n\n\n

        5. Ger\u00e7ek D\u00fcnya De\u011ferlendirmeleri<\/h2>\n\n\n\n
          \n
        • Modeller Aras\u0131 Varyasyon<\/strong>: Mobil Skylake yongalar\u0131 daha k\u00fc\u00e7\u00fckt\u00fcr ve masa\u00fcst\u00fc veya sunucu varyantlar\u0131na g\u00f6re yonga plakas\u0131 ba\u015f\u0131na daha fazla kal\u0131p \u00fcretir.<\/li>\n\n\n\n
        • Kusurlu Kal\u0131plar<\/strong>: Baz\u0131 kal\u0131plar kalite kontrollerinden ge\u00e7emez ve kullan\u0131lamaz ya da daha d\u00fc\u015f\u00fck seviyeli \u00fcr\u00fcnler olarak sat\u0131l\u0131r.<\/li>\n\n\n\n
        • Gelecek Trendleri<\/strong>: Sekt\u00f6r \u015fu y\u00f6ne do\u011fru ilerliyor daha b\u00fcy\u00fck gofretler (450mm)<\/strong> ve wafer ba\u015f\u0131na \u00fcretimi \u00f6nemli \u00f6l\u00e7\u00fcde art\u0131rabilecek geli\u015fmi\u015f paketleme.<\/li>\n<\/ul>\n\n\n\n

          6. Sonu\u00e7<\/h2>\n\n\n\n

          300mm'lik bir yonga plakas\u0131ndaki Skylake yongalar\u0131n\u0131n say\u0131s\u0131n\u0131 tahmin etmek geometri, verim istatistikleri ve ger\u00e7ek d\u00fcnya kusur analizini i\u00e7erir. Standart masa\u00fcst\u00fc Skylake kal\u0131plar\u0131 (~145 mm\u00b2) i\u00e7in tek bir 300 mm yonga plakas\u0131 yakla\u015f\u0131k 372-394 i\u015flevsel yonga \u00fcretebilir. Bu metri\u011fin anla\u015f\u0131lmas\u0131, yar\u0131 iletken end\u00fcstrisinde maliyet modellemesi, \u00fcretim planlamas\u0131 ve tahmin i\u00e7in \u00e7ok \u00f6nemlidir.<\/p>\n\n\n\n

          Yonga plakas\u0131 teknolojisi ve litografideki ilerlemeler sayesinde, gelecek nesil CPU'lar daha y\u00fcksek verim ve daha verimli \u00fcretim sa\u011flayacak ve bilgisayar inovasyonunun h\u0131zl\u0131 temposunu s\u00fcrd\u00fcrecektir.<\/p>","protected":false},"excerpt":{"rendered":"

          The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch) […]<\/p>\n","protected":false},"author":2,"featured_media":8799,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_uag_custom_page_level_css":"","footnotes":""},"categories":[27,12],"tags":[2167,2166,2169,2168,1225,1137,2165],"class_list":["post-8798","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-companynews","category-news","tag-300mm-wafer","tag-cpu-yield","tag-die-per-wafer","tag-intel-skylake","tag-semiconductor-manufacturing","tag-silicon-wafer","tag-skylake"],"acf":[],"uagb_featured_image_src":{"full":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-150x150.webp",150,150,true],"medium":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x225.webp",300,225,true],"medium_large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-768x576.webp",768,576,true],"large":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-1024x769.webp",800,601,true],"1536x1536":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"2048x2048":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6.webp",1447,1086,false],"trp-custom-language-flag":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-16x12.webp",16,12,true],"woocommerce_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-300x300.webp",300,300,true],"woocommerce_single":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-600x450.webp",600,450,true],"woocommerce_gallery_thumbnail":["https:\/\/www.sic-wafers.com\/wp-content\/uploads\/2026\/04\/64fbdfb5-c266-4e64-9da9-607bead0a5f6-100x100.webp",100,100,true]},"uagb_author_info":{"display_name":"lydia","author_link":"https:\/\/www.sic-wafers.com\/tr\/author\/lydia\/"},"uagb_comment_info":0,"uagb_excerpt":"The production of modern microprocessors, such as Intel\u2019s Skylake series, starts with large silicon wafers. Understanding how many chips a single wafer can yield is crucial for semiconductor manufacturers, hardware designers, and industry analysts. In this article, we will examine the factors that determine the number of Skylake chips produced from a standard 300mm (12-inch)…","_links":{"self":[{"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/posts\/8798","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/comments?post=8798"}],"version-history":[{"count":1,"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/posts\/8798\/revisions"}],"predecessor-version":[{"id":8800,"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/posts\/8798\/revisions\/8800"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/media\/8799"}],"wp:attachment":[{"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/media?parent=8798"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/categories?post=8798"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.sic-wafers.com\/tr\/wp-json\/wp\/v2\/tags?post=8798"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}