Descrizione
Il nostro custom through-via sapphire substrates are manufactured from high-quality single crystal sapphire and processed according to customer drawings. The substrate can be made with round via holes, micro hole arrays, square windows, cavities, slots, and special patterns.
The via structure can be used for vertical interconnection design, optical transmission, device alignment, packaging integration, sensor structure formation, and functional micro-device development. Different hole sizes, hole pitches, via quantities, substrate thicknesses, and external shapes can be customized to meet specific project requirements.
Sapphire is especially suitable for demanding environments where the substrate must maintain high strength, stable geometry, good transparency, and resistance to heat, chemicals, and mechanical wear.
Vantaggi principali
| Benefit | Descrizione |
|---|---|
| High-Strength Sapphire | Excellent hardness, scratch resistance, and mechanical durability |
| Precision Through-Via Processing | Micro holes, via arrays, alignment holes, and patterned openings available |
| Trasparenza ottica | Suitable for optical inspection, sensing, and photonic applications |
| Isolamento elettrico | Useful for electronic, RF, and packaging-related substrate designs |
| Stabilità termica | Stable performance under elevated temperature conditions |
| Resistenza chimica | Suitable for harsh processing and corrosive environments |
| Custom Geometry | Round wafers, square plates, rectangular substrates, and special shapes available |
Customizable Specifications
| Articolo | Available Options |
|---|---|
| Materiale | Single crystal sapphire / Al₂O₃ |
| Substrate Type | Wafer, plate, window, patterned substrate |
| Shape | Round, square, rectangular, custom shape |
| Structure | Through vias, micro holes, square openings, cavities, slots |
| Hole Layout | Single hole, multiple holes, dense array, custom pattern |
| Finitura superficiale | Single-side polished, double-side polished, custom finish |
| Edge Treatment | Chamfer, bevel, rounded edge, precision ground edge |
| Processing Method | Laser drilling, cutting, grinding, polishing, pattern machining |
| Production Type | Prototype, small batch, customized production |
Applicazioni tipiche
Advanced Semiconductor Packaging
Through-via sapphire substrates can be used in packaging research, wafer-level packaging, interposer-like structures, alignment carriers, and vertical structure development.
Dispositivi MEMS
Precision micro holes and patterned openings make sapphire suitable for MEMS sensors, pressure sensing components, micro cavities, and microstructure platforms.
Optical Sensors and Photonic Modules
With good transparency and high stability, sapphire can be used for optical windows, laser modules, imaging devices, photonic packaging, and inspection systems.
High-Reliability Electronic Components
Sapphire offers strong electrical insulation and excellent dimensional stability, making it suitable for selected high-frequency, RF, and electronic module applications.
R&D and Prototype Development
We support custom sapphire substrates for research projects, including small-batch samples, special via designs, unusual hole patterns, and customized substrate shapes.
Why Choose Sapphire for Through-Via Structures?
Why Choose Sapphire for Through-Via Structures?Sapphire is a single crystal aluminum oxide material known for its outstanding hardness and stable physical properties. For applications where ordinary glass may not provide enough strength or durability, sapphire offers a more robust substrate solution.
It is particularly valuable when the application requires:
High mechanical strength
Excellent scratch resistance
Stable optical performance
Strong chemical durability
Electrical insulation
Stabilità alle alte temperature
Precise microstructure processing
Customized hole and pattern design
For demanding packaging, MEMS, optical, and sensor applications, sapphire can provide both functional performance and long-term reliability.
Manufacturing Capabilities
Manufacturing CapabilitiesWe provide customized sapphire substrate processing based on drawings, samples, or technical requirements.
Our capabilities include:
Sapphire wafer cutting
Sapphire plate shaping
Laser micro-hole drilling
Through-via array processing
Square window machining
Cavity and slot processing
Double-side polishing
Edge grinding and chamfering
Custom pattern fabrication
Prototype and batch production
Information Required for Quotation
To evaluate your project quickly, please provide the following details:
Substrate material requirement
Wafer diameter or plate size
Spessore
Hole diameter
Hole depth or through-hole requirement
Hole quantity
Hole pitch and layout
Surface polishing requirement
Dimensional tolerance
Edge treatment requirement
Quantity
Application background
Drawings in PDF, DXF, CAD, STEP, or other technical formats are welcome.
FAQ
Q1: Is this a standard glass TGV substrate?
No. This product is made from sapphire. It uses TGV-style through-via structures, but the substrate material is single crystal sapphire, not ordinary glass.
Q2: Can sapphire be processed with micro via holes?
Yes. Sapphire can be laser processed or precision machined to form micro holes, through vias, hole arrays, square openings, and other custom patterns.
Q3: What shapes are available?
We can supply round sapphire wafers, square plates, rectangular substrates, and custom-shaped sapphire parts.
Q4: Can you make both holes and square windows on the same substrate?
Yes. Different structures, such as circular holes, square windows, cavities, slots, and alignment holes, can be combined according to the drawing.
Q5: Do you support prototype orders?
Yes. Prototype and small-batch production are available for R&D, testing, and design verification.
Recensioni
Ancora non ci sono recensioni.