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Key words:P Grade SiC Substrate,8-inch N-type SiC,8-inch SiC Wafer,N-type Silicon Carbide Crystal,SiC Power Device Substrate,SiC Crystal P Grade

P Grade 8inch N type SiC substrate ‘s abstratct

について 8-inch P Grade N-type SiC Substrate is a high-performance silicon carbide crystal substrate designed specifically for demanding power applications. Known for its high conductivity, this 8-inch N-type SiC for power devices provides exceptional thermal management and reliability, making it an ideal choice for high-voltage and high-temperature environments. Engineered as a P Grade 8-inch N-type SiC Wafer, this substrate offers superior purity and precision, ensuring efficient energy handling in critical applications.

Utilized in sectors like electric vehicles and industrial power, this 8-inch Silicon Carbide Power Device Substrate supports robust power conversion systems by maintaining stability even under extreme conditions. Its high purity そして N-type conductivity optimize it for power semiconductors, ensuring minimal energy loss and enhanced device longevity. As a P Grade SiC Crystal for electric vehicles, it’s instrumental in reducing power inefficiencies, supporting sustainable energy solutions.

Overall, the P Grade 8-inch N-type SiC Wafer is not only a foundation for next-generation power electronics but also a versatile 8-inch SiC for power semiconductors that addresses the rigorous demands of modern power device applications.

P Grade 8inch N type SiC substrate for semiconductor
P Grade 8inch N type SiC substrate

P Grade 8inch N type SiC substrate ‘s specification

P grade N type SiC Crystal Parameters
Polytype4H
Polytype AreaNone Permitted
マイクロパイプ密度-2
≤1 cm
Hex PlatesNone Permitted
Hexagonal PolycrystallineNone Permitted
Inclusionarea≤0.05%
抵抗率0.015Ω•cm—0.025Ω•cm
通常版≤8000 cm-2
TED≤6000 cm-2
BPD≤2000 cm-2
TSD≤1000 cm-2
SF≤1%
Metal Contamination(Al, Cr, Fe, Ni, Cu, Zn, Pb, Na, K, Ti, Ca, V, Mn) ≤1E11 cm-2
Mechanical Parameters
直径200.0 mm+0mm/-0.5mm
Surface Orientation4°toward <11-20>±0.5°
プライマリー・フラットの長さNotch
セカンダリー・フラットの長さなし
Notch Orientation<1-100>±1°
Notch Angle90° +5°/-1°
Notch Depth1mm +0.25mm/-0mm
Orthogonal Misorientation±5.0°
表面仕上げC-Face: Optical Polish, Si-Face: CMP
Wafer EdgeBeveling
表面粗さ
(10μm×10μm)
Si-Face:Ra≤0.2 nm C-Face:Ra≤0.5 nm
厚さ500.0μm±25.0μm
LTV (10mmx10mm)≤3μm
TTV≤10μm
≤25μm
Warp≤40μm
Surface Parameters
Chips/IndentsNone permitted≥0.5mm Width and Depth
a
Scratches
(Si face CS8520)
≤5 and Cumulative Length≤ 1 Wafer Diameter
a
TUA  (2mm*2mm)
≥95%
CracksNone Permitted
StainNone Permitted
Edge Exclusion3mm

P Grade 8inch N type SiC substrate ‘s properties

Key Properties of P Grade 8-inch N-type SiC Substrate:

  1. Size and Dimensions
    • 直径: 8 inches (approximately 200 mm)
    • 厚さ: Typically around 350 micrometers, with precise control to support consistent manufacturing processes.
  2. Crystal Type
    • Polytype: Available in both 4H-SiC and 6H-SiC configurations, depending on application needs, each offering specific properties in terms of electron mobility and thermal conductivity.
  3. Doping Type
    • N-type: Enhanced with nitrogen doping, ideal for high-power and high-frequency applications.
  4. 電気的特性
    • High Conductivity: P Grade 8inch N type SiC substrate Exhibits low electrical resistivity, supporting efficient current flow, which is crucial for power devices.
    • Breakdown Electric Field: High breakdown voltage, allowing it to withstand high voltages without degrading performance.
  5. 熱特性
    • 高い熱伝導性: Excellent heat dissipation capabilities, ensuring stable operation in high-temperature environments.
    • 熱膨張係数😛 Grade 8inch N type SiC substrate Low coefficient ensures structural integrity under thermal cycling.
  6. Purity and Quality Grade
    • P Grade: High purity, optimized for research and high-performance applications.
    • マイクロパイプ密度: Typically less than 0.5 cm², minimizing defects and improving device longevity.
  7. アプリケーション
    • Ideal for power devices in electric vehicles, renewable energy systems, industrial power supplies, and other high-performance semiconductor applications.
  8. 機械的特性
    • 高硬度: P Grade 8inch N type SiC substrate High on the Mohs hardness scale (~9.2), offering durability and resilience in device fabrication and operation.

メリット

These properties make the P Grade 8-inch N-type SiC substrate a top choice for next-generation power semiconductors, supporting innovations in energy-efficient, high-power electronic devices.

P Grade 8inch N type SiC substrate ‘s applications

1. Electric Vehicles (EVs)

2. Renewable Energy Systems

3. Industrial Power Supplies

4. Telecommunications

5. 航空宇宙・防衛

6. 医療機器

7. Data Centers and High-Performance Computing (HPC)

8. コンシューマー・エレクトロニクス

9. Railway and Public Transport Systems

10. Smart Grid Infrastructure

RFQ for P Grade 8inch N type SiC substrate

What is P Grade 8inch N type SiC substrate?

について P Grade 8-inch N-type SiC substrate is a high-purity silicon carbide (SiC) substrate specifically designed for power and high-frequency semiconductor applications. Here’s a breakdown of what each part of the name represents:

What is n type SiC?

N-type SiC (N-type silicon carbide) refers to silicon carbide (SiC) that has been doped to have an excess of electrons, making it electrically conductive. In N-type SiC, doping is typically achieved by introducing nitrogen atoms into the silicon carbide crystal structure. Here’s a breakdown of what makes N-type SiC unique:

Key Features of N-type SiC

  1. Doping with Nitrogen: In the SiC crystal lattice, nitrogen atoms substitute for some of the silicon or carbon atoms. Nitrogen has more electrons than silicon or carbon, resulting in an excess of free electrons in the lattice. These free electrons make the material electrically conductive, allowing it to carry current effectively.
  2. High Electron Mobility: N-type SiC has high electron mobility, meaning that electrons can move quickly through the material. This property is beneficial for high-frequency and high-power applications, where efficient electron flow is crucial.
  3. Thermal and Mechanical Stability: Like other forms of SiC, N-type SiC maintains its performance even at high temperatures and in harsh environments. Its excellent thermal conductivity helps in dissipating heat, which is essential for high-power devices.
  4. High Breakdown Voltage: N-type SiC can withstand high electric fields before it breaks down, making it suitable for power devices that operate at high voltages.

Applications of N-type SiC

Because of its ability to conduct current and withstand high temperatures and voltages, N-type SiC is widely used in power electronics, high-frequency devices, そして high-temperature applications. Some specific applications include:

In summary, N-type SiC is a doped form of silicon carbide that is optimized for electrical conductivity, making it a valuable material for devices requiring high efficiency, durability, and reliability under extreme conditions.

What is the difference between SiO2 and SiC?

SiO₂ (Silicon Dioxide) そして SiC (Silicon Carbide) are both materials widely used in various industrial applications, but they have fundamentally different properties and are used for different purposes due to their unique chemical compositions and physical characteristics. Here are the key differences:

1. 化学組成

2. 電気的特性

3. 熱特性

4. Mechanical Strength and Hardness

5. アプリケーション

6. 光学特性

Summary Table

プロパティSiO₂ (Silicon Dioxide)SiC (Silicon Carbide)
CompositionSilicon + OxygenSilicon + Carbon
Electrical PropertyInsulator半導体
熱伝導率中程度高い
Mechanical HardnessHard, brittleExtremely hard, wear-resistant
アプリケーションInsulator in electronics, optics, construction materialsPower electronics, abrasives, high-temp applications

In essence, SiO₂ is primarily an insulator with applications in electronics and optics, while SiC is a semiconductor known for its durability, high thermal conductivity, and suitability for high-power applications. These differences make each material uniquely suited to its respective industrial roles.

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