Description
Product Introduction
Wafer Mounting Ring, also referred to as a Wafer Frame Ring or Dicing Ring, is a precision-manufactured metal frame used to securely hold semiconductor wafers during critical fabrication processes. When combined with dicing tape or UV tape, the mounting ring provides reliable mechanical support, ensuring wafer stability throughout dicing, back grinding, polishing, bonding, and temporary handling operations.
Manufactured from 420 stainless steel, wafer mounting rings offer high rigidity, stable flatness, and excellent wear resistance. These characteristics make them particularly suitable for high-speed dicing lines and high-precision semiconductor packaging environments where dimensional consistency and process reliability are essential.
As a reusable consumable, wafer mounting rings are designed to withstand repeated cleaning and reuse cycles, helping manufacturers reduce operating costs while maintaining stable process performance.
Product Features
Manufactured from 420 stainless steel with heat treatment for enhanced hardness
High rigidity and bending resistance for stable wafer fixation
Excellent flatness control to support high-precision dicing and grinding
Smooth surface finish suitable for cleanroom environments
Designed for repeated cleaning, refurbishment, and reuse
Compatible with most standard wafer dicing and mounting equipment
Custom sizes, thicknesses, and edge designs available
Technical Parameters
General Specifications
| Item | Specification |
|---|---|
| Product Name | Wafer Mounting Ring |
| Also Known As | Wafer Frame Ring / Dicing Ring |
| Brand | XINKEHUI |
| Material | 420 Stainless Steel |
| Available Sizes | 6”, 8”, 12” |
| Thickness | 1.2 mm (6” / 8”), 1.5 mm (12”) |
| Hardness | HRC 48–55 |
| Flatness | ≤ 0.2 mm (6” / 8”), ≤ 0.3 mm (12”) |
| Surface Finish | Bright (BA) or Hairline (HL) |
| Reusability | Yes |
| Manufacturing Standards | GB/T1184-K, GB/T1804-M |
Size Reference (Typical)
| Size (Inch) | Outer Diameter (mm) | Inner Diameter (mm) | Thickness (mm) | Flatness |
|---|---|---|---|---|
| 6” | ~228 | ~388 | 1.2 | ≤ 0.2 mm |
| 8” | ~296 | ~500 | 1.2 | ≤ 0.2 mm |
| 12” | ~400 | ~700 | 1.5 | ≤ 0.3 mm |
Exact dimensions can be customized based on drawings or samples.
Applications
Wafer mounting rings are widely used in the following semiconductor processes:
Wafer dicing / die saw operations
Wafer back grinding and thinning
Film mounting with blue tape or UV tape
Die attach and bonding processes
LED and power semiconductor packaging
Temporary wafer transportation and handling
Quality Control & Manufacturing
XINKEHUI applies strict quality control throughout the manufacturing process of wafer mounting rings. Raw materials are carefully selected to ensure consistent mechanical properties. Precision machining, controlled heat treatment, and surface finishing are performed to achieve stable hardness and flatness.
Each wafer mounting ring undergoes inspection for dimensional accuracy, flatness, and surface condition before delivery. This ensures reliable performance in demanding semiconductor production environments.
Customization & Additional Services
XINKEHUI provides comprehensive customization and value-added services, including:
Custom outer and inner dimensions
Thickness adjustment and special edge designs
Professional wafer frame cleaning and refurbishment
Laser engraving (serial number, QR code, barcode, logo)
Cleanroom-grade or vacuum packaging
Our engineering team supports drawing review and application matching to ensure compatibility with customer equipment and processes.
Frequently Asked Questions (FAQ)
1. What is the main purpose of a wafer mounting ring?
A wafer mounting ring is used to securely fix a semiconductor wafer together with dicing tape or UV tape during processes such as dicing, grinding, and bonding. It provides mechanical rigidity and prevents wafer movement during high-precision operations.
2. Why is 420 stainless steel commonly used for wafer mounting rings?
420 stainless steel offers high hardness, good wear resistance, and stable flatness after heat treatment. These properties make it suitable for repeated cleaning cycles and high-speed semiconductor processing.
3. Can wafer mounting rings be reused?
Yes. XINKEHUI wafer mounting rings are designed for reuse. With proper professional cleaning and inspection, they can be reused multiple times without compromising performance.
4. How does flatness affect wafer processing?
Poor flatness can lead to uneven tape tension, wafer tilt, or localized stress during dicing and grinding. High-flatness wafer mounting rings help improve cutting accuracy and reduce die damage.
5. Are XINKEHUI wafer mounting rings compatible with standard dicing equipment?
XINKEHUI wafer mounting rings are manufactured according to common industry standards and are compatible with most manual and automated wafer mounting and dicing systems. Custom specifications are also available.
6. Can laser marking be added to the wafer mounting ring?
Yes. Laser engraving such as serial numbers, QR codes, barcodes, or logos can be added to support traceability and production management.
Summary
The XINKEHUI Wafer Mounting Ring is a reliable, high-precision solution for wafer handling in semiconductor manufacturing. With stable flatness, high rigidity, and long service life, it supports consistent process performance across a wide range of wafer dicing and mounting applications.
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