Thin SiC Wafer Handling from Backgrinding to Dicing: Ring Frame Mounting, Tape Stress, Warpage and Edge Chipping Control
As silicon carbide wafers move toward thinner substrates for power semiconductor manufacturing, wafer handling becomes increasingly important. A standard SiC wafer may remain relatively rigid during conventional processing, but after backgrinding, the reduction in thickness significantly increases sensitivity to bending stress, local pressure, tape tension and mechanical impact. For thin SiC wafers, the transition from […]