Sustrato de SiC 4H-N para electrónica de potencia, dispositivos de RF y optoelectrónica UV

The 4H-N SiC Substrate is a high-purity, single-crystal semiconductor material manufactured using the Physical Vapor Transport (PVT) method. With extremely low defect density, excellent thermal conductivity, and stable electrical characteristics, it is widely used in power electronics, RF/microwave components, and UV optoelectronic devices.

Descripción

The 4H-N SiC Substrate is a high-purity, single-crystal semiconductor material manufactured using the Physical Vapor Transport (PVT) method. With extremely low defect density, excellent thermal conductivity, and stable electrical characteristics, it is widely used in power electronics, RF/microwave components, and UV optoelectronic devices.

The compact 10×10 mm format is ideal for R&D, device prototyping, epitaxial testing, and laboratory semiconductor research.

Características principales

Prime-Grade Crystal Quality

  • Polytype: 4H-SiC

  • Conductivity: N-type

  • Micropipe Density (MPD): <1 cm⁻²

  • Threading Dislocation Density: <10⁴ cm⁻²

Ultra-Smooth, Epi-Ready Surfaces

  • Si-face (CMP): Ra ≤ 0.5 nm

  • C-face: Ra ≤ 1 nm

  • Suitable for MOCVD, CVD, and HVPE epitaxy

Stable Electrical Properties

  • Resistivity: 0.01–0.1 Ω·cm

  • Carrier concentration: 1×10¹⁸ – 5×10¹⁹ cm⁻³

  • Supports high-voltage and high-frequency device structures

Excellent Thermal Performance

  • Thermal conductivity: ~490 W/m·K

  • Operating temperature: up to 600°C

  • CTE: 4.0×10⁻⁶ /K

Alta resistencia mecánica

  • Vickers hardness: 28–32 GPa

  • Flexural strength: >400 MPa

  • Highly durable and wear-resistant

Especificaciones técnicas

CategoryEspecificación
Material4H-SiC Single Crystal (N-type)
Dimensions10×10 mm (±0.05 mm)
Thickness Options100–500 μm
Orientación(0001) ± 0.5°
Calidad de la superficieCMP / Polished, Ra ≤ 0.5 nm
Resistividad0.01–0.1 Ω·cm
Conductividad térmica490 W/m·K
DefectosMPD < 1 cm⁻²
ColorGreen-tea surface tone
Grade OptionsPrime, Research, Dummy

Available Customization

  • Sizes: 5×5 mm, 5×10 mm, 10×20 mm, Ø2–8 inch

  • Thickness: 100–500 μm or custom

  • Orientation: on-axis, 4°, or 8° off-axis

  • Surface Finish: SSP/DSP optional

  • Doping Options: N-type, P-type, semi-insulating

  • Backside metallization available

Aplicaciones

Electrónica de potencia

SiC MOSFETs, Schottky diodes, high-voltage power devices.

RF & 5G Communication

RF power amplifiers, mm-wave modules, high-frequency switches.

New Energy Vehicles

EV inverters, power module development, wide-bandgap testing.

Aeroespacial y defensa

High-temperature, radiation-resistant device manufacturing.

Optoelectrónica

UV LEDs, photodiodes, GaN/AlN epitaxy, laser structures.

Research & Laboratory Use

Material characterization, epitaxy research, device prototyping.

PREGUNTAS FRECUENTES

1. What advantages does 4H-SiC have over 6H-SiC?
4H-SiC provides higher electron mobility, lower on-resistance, and better performance in high-power and high-frequency devices.

2. Do you supply conductive or semi-insulating SiC substrates?
Yes. Both N-type conductive and semi-insulating 4H-SiC substrates are available with customizable resistivity.

3. Is this substrate ready for epitaxy?
Yes. The CMP-polished Si-face is epi-ready and suitable for GaN, AlN, and SiC epitaxial growth using MOCVD, CVD, or HVPE.

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