先端半導体・極限環境用途向け大面積正方形サファイア基板

The 310 × 310 × 1 mm Large-Area Square Sapphire Substrate is a precision-engineered sapphire plate produced from high-purity single-crystal aluminum oxide (Al₂O₃).

説明

The 310 × 310 × 1 mm Large-Area Square Sapphire Substrate is a precision-engineered sapphire plate produced from high-purity single-crystal aluminum oxide (Al₂O₃). Designed for applications that exceed the dimensional limits of conventional sapphire wafers, this ultra-large substrate provides excellent flatness, thermal endurance, and mechanical integrity across a square geometry.

This product is not a standard semiconductor wafer. Instead, it is optimized as a functional sapphire substrate or carrier plate for semiconductor processing, optical systems, and aerospace environments where large surface area, dimensional stability, and resistance to extreme conditions are required.

代表的な使用例

  • Carrier and support substrates for semiconductor processing

  • GaN-on-Sapphire epitaxial carrier plates

  • Large-area optical and laser windows

  • High-temperature or vacuum viewports

  • Structural sapphire base plates

  • Research and custom industrial platforms

技術仕様

パラメータ仕様
素材Single Crystal Sapphire (Al₂O₃)
Crystal Purity≥ 99.99%
GeometrySquare
Overall Dimensions310 × 310 mm
Nominal Thickness1.0 mm
厚さ公差± 0.02 mm
Total Thickness Variation (TTV)< 10 μm
クリスタルの向きCプレーン (0001)
Surface ProcessingDouble-Side Polished (DSP)
表面粗さRa < 0.2 nm
表面の平坦度λ/10 @ 633 nm
Edge TreatmentChamfered / Radius Corners
Optical GradeHigh Optical Quality
硬度モース9
密度3.98 g/cm³
熱伝導率~35 W/m·K (25 °C)
Maximum Service Temperature> 1600 °C
化学的安定性Excellent resistance to acids and alkalis

Performance Advantages

Large-Area Dimensional Stability310 × 310 × 1 mm 大面積正方形サファイア基板

Maintains high flatness and tight thickness control across a 310 mm square surface, enabling reliable use in large-format systems.

高い機械的強度

The intrinsic hardness and strength of sapphire reduce the risk of surface damage and deformation during handling and operation.

Thermal Endurance

Capable of sustaining high-temperature cycles typical of epitaxial growth, thermal processing, and aerospace environments.

Optical-Grade Surface Finish

Sub-nanometer surface roughness enables use in optical transmission, bonding, and precision alignment applications.

化学的不活性

Superior resistance to corrosive gases, acids, and alkalis compared with glass or fused quartz substrates.

Manufacturing & Inspection

  • Synthetic sapphire crystal growth

  • Precision cutting and stress-relief processing

  • Large-format double-side polishing

  • Interferometric flatness measurement

  • Full dimensional and visual inspection prior to shipment

Frequently Asked Questions

Q1: How should this product be classified?310 × 310 × 1 mm 大面積正方形サファイア基板
This product is classified as a large-area sapphire substrate or carrier plate, not a standard semiconductor wafer.

Q2: Are other sizes or thicknesses available?
Yes. Custom square or rectangular dimensions from 250 mm to 310 mm per side and various thicknesses are available upon request.

Q3: Is this suitable for GaN epitaxial processing?
Yes. It is commonly used as a GaN-on-Sapphire carrier substrate in MOCVD and related epitaxial systems.

Q4: How is surface flatness verified?
Each substrate is measured using laser interferometry to ensure λ/10 flatness at 633 nm.

Q5: How is the substrate protected during shipping?
Products are packed in custom shock-absorbing, clean-grade packaging designed specifically for ultra-large sapphire components.

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