6H-N SiC-substrat för högtemperatur-, UV- och precisionselektronik

Industrial-grade 6H-N Silicon Carbide (SiC) substrates are high-quality single-crystal wafers engineered for high-temperature, UV optoelectronic, och precision industrial electronic applications.

Beskrivning

Industrial-grade 6H-N Silicon Carbide (SiC) substrates are high-quality single-crystal wafers engineered for high-temperature, UV optoelectronic, och precision industrial electronic applications.


Compared with the widely used 4H SiC polytype, 6H SiC features excellent thermal stability, mechanical hardness, and cost advantages, making it ideal for UV LEDs, high-temperature sensors, aerospace electronics, and industrial-grade power components.

Viktiga funktioner

  • 6H Hexagonal Crystal Structure
    Offers dimensional stability, mechanical strength, and reliable performance under high thermal stress.

  • N-Type Conductivity
    Suitable for high-temperature electronics, UV devices, and specialized power circuits.

  • High Thermal Conductivity (≈390–450 W/m·K)
    Ensures efficient heat removal and enhances device lifetime.

  • Superior Mechanical & Chemical Durability
    High hardness, corrosion resistance, and robustness during processing.

  • Epi-Ready Surface Options
    CMP, DSP, and SSP finishes available for epitaxial growth and R&D.

  • Customizable Sizes & Thickness
    Standard diameters and square formats available for flexible integration.

Tillämpningar

  • High-temperature semiconductor devices and industrial sensors

  • UV LEDs, UV detectors, and optoelectronic modules

  • Aerospace and automotive electronics exposed to extreme conditions

  • Compact, robust industrial power devices

  • R&D and pilot-scale production in wide-bandgap semiconductors

Technical Specifications (Typical & Customizable)

ParameterSpecifikation
MaterialSingle-Crystal 6H-N SiC
KristallstrukturHexagonal (6H)
Diameter / Size25 mm, 50 mm, 100 mm, 150 mm, 200 mm, 300 mm; square or custom
Tjocklek350–1,000 µm (customizable)
YtfinishCMP epi-ready, DSP, SSP
Total Thickness Variation (TTV)≤5 µm typical
Bow / Warp≤40 µm (6″ typical)
Mikrorörets täthet<0.1 cm⁻² (premium <0.01 cm⁻²)
Dislokationstäthet<10⁴ cm⁻²
ConductivityN-type (conductive), SI optional
Epi-ReadyYes — supports epitaxial growth

Square Substrate Advantages

  • Enhanced electrode alignment for UV LEDs och sensorer för höga temperaturer

  • Improved device integration for industrial control circuits

  • Semi-insulating option enables RF and microwave low-loss performance

Manufacturing Process

  1. High-purity SiC powder synthesis

  2. Seed attachment and 6H polytype configuration

  3. Sublimation crystal growth at 2300–2500°C

  4. Diamond wire sawing into wafers

  5. CMP or diamond polishing to achieve epi-ready surfaces

  6. Optical inspection and CoA certification

Key Use Cases

  • High-temperature and high-voltage electronics

  • UV optoelectronic modules

  • Aerospace and defense systems

  • Industrial power solutions for harsh environments

  • Laboratory research and pilot device development

VANLIGA FRÅGOR

1. What differentiates 6H-N SiC from 4H SiC?
6H-N SiC has slightly lower electron mobility but superior thermal stability and cost advantages for UV and high-temperature applications, while 4H SiC is optimized for fast, high-efficiency power devices.

2. Can 6H-N SiC operate under extreme temperatures?
Yes. It maintains structural and electrical stability at very high temperatures.

3. Are sizes and finishes customizable?
Absolutely — diameter, thickness, surface finish, and conductivity are fully customizable for R&D or mass production.

4. Which industries commonly use 6H-N SiC substrates?
UV optoelectronics, high-temperature sensors, aerospace, automotive electronics, and industrial-grade power modules.

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